1 Wide Application
It is used to photo-etch all kinds of substrateswith diameter below Φ100mm (minimum size is 5×5mm) andthickness below 5mm, including noncircular substrates.
2 High Resolution
Adopting multipoint light source (fly's eye)phtotohead of high uniformity, perfect three-point levelling mechanism and stable and reliable vacuum seal device, exposure resolution of the machine is greatly improved.
3 High Accuracy & High Speed of Aligning
The aligning mode features with underneath type quintuplicate guideway with stationary mask frame and mobile substrate. The load-bearing platform elevating uses spherical guide, pneumatic Z axis mechanism, and twin reed micro- separation mechanism, which enable the contact and separation between the substrate and mask to have small drift, high accuracy and high speed of aligning, thereby the reusability and rate of the finished products are improved.
4. High Reliability
With PLC controller, imported electromagnetic valve, button, unique pneumatic system,vacuum pipeline system and parts which are processed by precision machine production technique, this machine has high reliability and it is very simple and convenient to manipulate, maintain and repair.
5. Special Function of Processing Fragments
It solves the problem that mask frame and substrate can’t be aligned because of adhesion between them, which is caused by noncircular substrates, fragments and uneven bottom surface of substrates.
