Main Application
This machine is used to develop and manufacture medium and small-scale integrated circuits,semiconductor devices, photoelectronic device and sonic surface components.
Main Structure
It consists of high degree of accuracy aligning worktable, binocular field-spitting microscope (or CCD micrographic display system), phtotohead, pneumatic system, vacuum pipeline system, monoblock vacuum pump, vibration- resistance worktable and accessories case, etc..
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Main Functional Characteristics
1.Wide Application
It is used to photo-etch all kinds of substrates with iameter below 100mm and thickness below 5mm, including noncircular bstrates.
2.Advanced Structure
Air float levelling mechanism; Vacuum seal mechanism which realizes vacuum hard-contact, soft-contact and small-force contact; Vacuum mask frame and vacuum slide sucker.
3.Handy Manipulation
It fetches and places the substrate by turning over the plate. By pressing the buttons, it realizes vacuum sorption of mask, substrate, floating ball,and scan lock. It’s very simple and convenient to manipulate, debug,maintain and repair.
4.High Reliability
It adopts imported electromagnetic valve, button and timer. With unique pneumatic system, vacuum pipeline system and precision machining of parts, the system equips with high reliability.
5.Special Function of Processing Fragments
It solves the problem that mask and substrate can’t be aligned because of adhesion between them, which is caused by noncircular substrates, fragments and uneven bottom surface of substrates.
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